AL3158
HIGH EFFICIENCY 1x/2x CHARGE PUMP
FOR WHITE LED APPLICATIONS
Absolute Maximum Ratings (Note 2)
Symbol
ESD HBM
ESD MM
V IN
V EN1,2,3
I OUT
T J
T LEAD
Description
Human Body Model ESD Protection
Machine Model ESD Protection
Input Voltage
EN1, EN2, EN3 to GND Voltage
Maximum DC Output Current
Operating Junction Temperature Range
Maximum Soldering Temperature (at leads, 10 sec)
Rating
2
200
-0.3 to 6
-0.3 to V IN +0.3
270
150
300
Unit
KV
V
V
V
mA
° C
° C
Notes:
2. Exceeding Absolute Maximum Ratings will cause permanent damage to the device.
Recommended Operating Conditions
Symbol
V IN
T A
Parameter
Input Voltage
Operating Ambient Temperature
Min
2.7
-40
Max
5.5
85
Unit
V
°C
Electrical Characteristics (T A = 25 ° C, Vin = 3.6V,
C IN = C OUT = 2.2μF, C 1 = 1μF Unless otherwise noted)
Symbol
I Q
I SHDN
Parameter
Quiescent Current
Shutdown Current
Test Conditions
1x Mode, 3.0 ≤ V IN ≤ 5.5, Active,
No Load Current
2x Mode, 3.0 ≤ V IN ≤ 5.5, Active,
No Load Current
EN1, EN2, EN3 = 0
Min
Typ.
0.3
2
Max
0.6
5
1
Unit
mA
μA
I DX
I D-Match
R out
V TH
V HS
T SS
Fsw
I SINK Current Accuracy (Note 3)
Current Matching Between Any Two
Current Sink Inputs (Note 4)
Open Loop V OUT Resistance
1x to 2x Transition Threshold at Any
I SINK Pin
Mode Transition Hysteresis
Soft-Start Time
Switching Frequency
V F : D1:D9 = 3.6V
1x mode
2 x mode
I DX = 20mA
19
20
1
0.5
4.5
150
250
100
1.2
21
2
mA
%
Ω
mV
mV
μs
MHz
V EN1, 2,3 (L)
V EN1,2,3(H)
T EN1,2,3
EN1,2,3 Threshold Low
EN1,2,3 Threshold High
EN1,2,3 Off Timeout
V IN = 2.7V
V IN = 5.5V
1.4
0.4
20
V
V
ms
UVLO
I EN1,2,3
T SHDN
T HYS
θ JA
V IN Under-Voltage Lockout
EN1,2,3 Input Leakage
Thermal shutdown Protection
Thermal shutdown hysteresis
Thermal Resistance Junction-to-
Ambient
QFN3030-20 (Note 5)
1.8
-1
2
160
10
52
2.2
1
o
V
μA
° C
° C
C/W
Notes: 3. Determined by the average current levels of all active channels.
4. Determined by the maximum sink current (MAX), the minimum sink current (MIN), and the average sink current (AVG). Two matching numbers are
calculated as (MAX-AVG)/AVG and (AVG-MIN)/AVG. The largest number of the two (worst case) is considered as the matching data.
5. Device mounted on FR-4 substrate, 2"*2", 2oz copper, double-sided PC board, with minimum recommended pad on top layer and
4 vias to bottom layer.
AL3158
Document number: DS35047 Rev. 2 - 2
3 of 10
www.diodes.com
January 2011
? Diodes Incorporated
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